- Events
- Articles
- Updates
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PCB Heat Dissipation Solutions for High-Performance Systems
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PCB Manufacturing: Processes, Technologies, Standards
events
MEET US @ FOCUSON PCB 2025
Come visit us at booth H45, 21th-22nd of May
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PCB Design for Radio Frequency & Microwave Module solutions
Learn about our advanced PCB design solutions offering high-performance Thermal Management options for Radio Frequency & Microwave applications.
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Design Considerations for IC Substrates and Chiplet Integration
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MEET US @ APEC 2025
MEET US AT THE APEC 2025 CONFERENCE
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MEET US @ iMAPS MEDICAL 2025
MEET US AT THE iMAPS MEDICAL 2025 CONFERENCE
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MEET US @ THE PCB EAST CONFERENCE
Come visit us at booth 201, between 30th April - 2 May 2025.
updates
Quality Policy and Certifications
Company standards, certifications and quality policy
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Flex Rigid PCBs: Why You Should Use Them
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Multi-chip Modules & System-in-Package Technologies
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HDI PCBs: HDI Boards – High Density Interconnect PCBs
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Panel-Level Packaging vs. Wafer-Level Packaging
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An In-depth Look at Wire Bonding Options
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SLP – Substrate-Like PCB Technology
Eye-opening interview with PCB Technologies’ CTO Yaad Eliya about SLP Technology; exploring its huge growth potential and far-reaching impact on the design, fabrication and manufacturing processes of today’s hottest new products, applications, and near-future innovations.
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Antenna-In-Package (AiP) Solutions: The Time is Now
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Die Stacking Technology Where Less is Moore in PCB Design & Manufacturing
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Range of IC Packaging Design Formats
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MEET US @ THE IMAPS CONFERENCE / EXHIBITION
Radio Frequency Integrated Circuits Symposium, June 16-21, 2024, Washington, DC. USA
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MEET US @ THE PCB WEST CONFERENCE
We’ve got you covered at the upcoming PCB WEST exhibition: Booth #308
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Flip Chip Vs. Wire Bonding Technology
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Advanced QFN Technologies - Panel-Level Assembly, Near-Hermetic Sealing & Testing
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Organic QFN IC Packages: Comparing Packaging Options QFN, LGA & Materials
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QFN IC Packages | Panel Level Process for Organic Types
Yaniv Maydar is V.P. R&D and Innovation at PCB Technologies Ltd., and head of our iNPACK Division. Yaniv’s robust skill-set encompasses Systems Engineering, RF and Embedded Systems, with extensive cross-platform experience in microwave R&D, System Packaging Technologies, and large-scale projects in the fields of miniaturized systems, MMIC design, RF COMS and more. He is a key contributor to groundbreaking technological solutions for the company on IC Packaging and Organic Substrates. In addition, he is a highly-regarded industry influencer and author of many of our technical articles, while acting as an advisory to our clients in the semiconductor sector.
updates
Equal pay law for female and male employees – 2023 Publication
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PCB Fabrication: Subtractive vs. mSAP
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MEET US @ IMS 2024
Customized IC Packaging, Thermal Management,
Substrate Design, Film-Assisted Molding & More.
events
MEET US @ PCB East 2024 | PCB Technologies
PCB Technologies USA is a proud sponsor of this leading electronics-industry event
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PCBs - The Critical Core Component in Medical Devices & Equipment
Learn about the Critical Core Component in Medical Devices & Equipment, by PCB Technologies.
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PCB Thermal Management Solutions
PCBs are the first heat management platform that electrical components meet. How you choose to handle the heat very much depends on the power dissipated from constituent components, line losses, board design, circuit editing, and mechanical structure. There are also thermal effects that arise from interconnect options on the board level, vias, transmission lines and assembly pad design.
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iNPACK™ Panel Level Solutions
PCB Technologies’ iNPACK Division offers complete package PCB assembly solutions for both low and high-volume requirements. This includes SiP-system in package design and manufacturing, surface mount tech, chip on board (COB), microfabrication, and substrate design and manufacturing capabilities.
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Miniaturization: The New Frontier in Aerospace
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SiP Reliability Analysis & Testing
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X-VIA Technology: Critical for HDI Packages
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Why Introduce Graphene into Advanced PCBs?
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Focusing on Substrate PCB
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When is a Miniaturized PCBA the Right Option for You?
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The Complexities of Microelectronics Microwave Modules
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‘Moore’ than a PCB – Breakthrough Solutions
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What mSAP Technology Can Do for Your Advanced Applications
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Equality woman and man
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Radio Frequency (RF) Heat Dissipation and Coins Technology
As technology continues to evolve, so does the demand for improved thermal management and higher RF performance for PCBs and subsystems. As applications become more complex, and SWaP constraints become a priority, the need for innovative solutions has become even more pressing. Industries such as defense, aerospace, medical, and sensor applications require these solutions to decrease in size while offering greater functionality than ever before. In this article, we will dive into the different approaches to thermal management and compare the advantages of "Coin" technology with traditional thermal via technology to see how they stack up.
events
Introducing iNPACK™ | PCB Technologies exposure conference
We have gone from a mini-manufacturer to a full-fielded development center for our customers and received valuable feedback reinforcing our company's worth.
Check out our recent customer conference video at PCB Technologies! It was a huge success, showcasing our capabilities and expertise in miniaturization, substrate production, and more. Around 200 professionals attended and the level of engagement was outstanding.
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Extreme heat dissipation solution in PWB stage
The challenge at hand was providing the customer with an extreme heat dissipation-resistant PCB, to be installed in an electronic device releasing a large amount of heat during its operation, thus utilizing the PCBs as a cooling system.
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How can you ensure your customer a QTA (Quick Turn Around)
How can you ensure your customer a QTA (Quick Turn Around)
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All-in-One Substrates and Advanced Packaging Solutions
How does an All-in-One solution definitely benefit the customer?
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PCB Technologies Launches iNPACK, a Miniaturization, and Advanced Packaging Solution Provider
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Introducing Graphene into advanced printed circuit boards
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Our new CU fill (electroplated) machine enabling enhanced system performance
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Modified Semi Additive Process (mSAP) boosts High-Density Interconnect (HDI) PCB capabilities
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Miniaturization - special laminate materials and buried capacitors technology in the works
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Miniaturization technology - Controlling thermal expansion and power dissipation
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Supporting Semiconductors machine manufacturers
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Test and Inspection Management
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The best of both worlds
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Solid data management – key to accurate quotes
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Innovation at its best – Packaging solutions at the COMCAS conference
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Enhanced capacity for precise and speedy production
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New miniaturization technology
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In-house HATS (Highly Accelerated Thermal Shock) lab- Evaluating reliability for extended survivability
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All-in-One – the lab inspection angle
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Why just dense when you can miniaturize?
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PCB Technologies in support of the Aerospace industry
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Coins insert – the advanced heat dissipation method for cooling electronic devices
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All in One at all levels -repeatability, lead-time & original design v. final product
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A new back drill technique guarantees increased depth control and tolerance
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Manufacturing methods of #1-mill-line/space using subtractive processing in a HMLV industry
updates
We were awarded with a large production contract of PCBs for the world's leading anti-missiles systems "Iron Dome"
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PCB Technologies’ new miniaturization capabilities
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Proud to be a member of the Israeli Graphene Consortium
PCB Technologies, a world leader in PCB manufacturing, was chosen as a member of the Israeli Graphene Consortium alongside with other well established industries leaders such as Mellanox, Simtal Nano Coatings and also well-known Academic institutes – Ben Gurion University, the Technion, and the University of Bar-Ilan.
updates
PCB Technologies Expands Capabilities
Nolan Johnson speaks with Arik Einhorn and Yaad Eliya of Israel-based PCB Technologies about how they’ve increased their capabilities down to 1 mil line and space to better support their customers from the military, aerospace, and medical markets.
updates
Designated assembly line for Elbit systems
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Breaking the Circle: The Potential of PCB Technologies
The shares of companies in the field of electrical components traded in the United States have yielded an average return of about 10% in the past year, compared to almost 50% in the NASDAQ index. The stock of the printed circuit board manufacturer, which is controlled by the FIMI Fund, is currently trading at an interesting price
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PCB Technologies producing 1 mil lines space PCBs
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PCB Technologies Focuses on an All-in-One Solution
An interview conducted with Arik Einhorn on IConnect007 to find out about the All-in-One capabilities that PCB Technologies has to offer from higher-complexity PCB with the scalability to handle prototyping all the way through mass production if needed.