Meet us at IMS 2026
9-12 of June, 2026

WELCOME TO BOOTH 19096: EXPERTISE BEYOND THE ORDINARY:

HDI, Rigid/Rigid-Flex, RF/Microwave Boards, Heat Management, Signal Integrity & Custom Solutions –
PCB, PCBA & Featuring Our iNPACK Division, Specializing in Miniaturization + Innovative IC Packaging
Solutions. ‘Where Miniaturization Meets Rugged Reliability’ for Aerospace, Defense, High-Frequency
Telecom and other critical applications the world over.

WHAT IS OUR ALL-IN-ONE SOLUTION?

It’s a powerful vertical integration of advanced technological
capabilities shared among three key divisions at PCB Technologies; all located within the same expansive
facility. Ensuring smooth, comprehensive fabrication processes with continuous quality oversight and quick
cycle-times. Our customers depend on it!

BOOK A MEETING with our experts to discuss RF/MW applications and any other issues of importance to
you. We look forward to it!

Warm Regards,
PCB Technologies, Tech-Team