Superior heat dissipation, organic substrate and advanced packaging solutions
The ever-growing demand for energy-consuming appliances in our daily lives, creates the need for renewable energy and high-power applications solutions. Just a few examples of that are LED lighting panels and energy-saving GPS technology devices; all of which rely on quality, high reliability, high performance PCBs to manage their performance in various environmental conditions, while using alternative energy resources, such as wind, solar or hydroelectric energy.
We, at PCB Technologies, offer our customers an All-in-One solution to meet these demands.
The greater benefit of this approach materializes if we can get involved in your project from the early stages of your PCB design, through its fabrication, and testing; especially when it comes to organic substrate and advanced packaging solutions, allowing their miniaturization to tiny form factors. Our decade-long experience in thermal management enabling heat dissipation of these high-power components can come in handy when designing your PCB, taking into account, not only the technological aspect but also cost-effectiveness and supply chain constraints.
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There are numerous types of sensors that require PCB design and fabrication - flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.
Controller & Motion Systems/C4I Systems
Under controller systems applications, such as encoder position, piezo motors, servo compensation, step motor stall detection, brushless DC motor commutation, micro-step generation, digital current/torque control, and more, require a unique design and production of PCBs.
PCB designs for controllers and motion systems, such as C4I applications, require the ability to support sufficient current to the load, noise immunity for the load, and accurate current sensing.
In the case of motion controllers with integrated power electronics, network communications, and derive DC, step motors require specific PCB design rules.
Other PCB factors, such as compact size, range of power output levels, vibration, and high level of connectivity make PCB design and manufacturing challenging.
Fully automated factories relying on data automation efficiency and productivity are constantly increasing their utilization of technological advancements made in autonomous robots, big data, and internet of things (IoT), machine learning, simulation, and system integration. The main incentive of industry 4.0 manufacturers is to track down manufacturing errors as they occur. Big volumes of data analysis require highly reliable PCBs which should be tested and process controlled through each of their production stages. Industries 4.0 also requires PCB design which is able to combine RF, advances processors, antennas, miniaturization, optics and advanced technologies into one integrated system. PCB Technologies is the perfect fit in terms of know-how based on long years of PCB design and manufacturing, PCBA and full system integration.
High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.
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