Advanced Packaging & Organic Substrates – All-in-One Solutions
We offer Organic Substrate expertise with High-Density Line/Space Width and Advanced Packaging, that allows for smaller form factor and increased functionality, high thermal conductivity, and improved process stability.
SiP-system in package prototypes or low/mid volume production – highly compatible with aerospace, defense, medical, and other top industry needs, is our core business. We specialize in heat dissipation solutions that ensure your projects meet high standards of performance and reliability in the shortest possible time to market.