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Miniaturization - iNPACK

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Advanced IC Packaging & Organic Substrates – All-in-One Solutions

We offer Organic Substrate expertise with High-Density Line/Space Width and Advanced Packaging, that allows for smaller form factor and increased functionality, high thermal conductivity, and improved process stability.
SiP-system in package prototypes or low/mid volume production, multi chip module (MCM) – highly compatible with aerospace, defense, medical, and other top industry needs, is our core business. We specialize in heat dissipation solutions that ensure your projects meet high standards of performance and reliability in the shortest possible time to market.

Standards

Relevant Services

SiP Design

NPI - New Product Introduction

Reballing & BGA Replacement

Purchasing

Bare Die & Component Sourcing

Comprehensive Testing Plan

DfX/DfM

Full Turnkey

Full System Integration

Circuit Editing

Shipping

Planning

Substrate Design

Our Substrate-like PCB or (SLP technology) rely on conventional PCB subtractive processes, but with a PPI resolution of 20 microns. The substrate is characterized not only by its resolution level but also by heat dissipation qualities, specific to thermal management of electronic devices, and interconnection capabilities. We focus on resolving any CTE mismatch between substrate and PCB, or dies and substrate; critical first and second-level reliability issues. We aim to enhance system reliability by using organic substrate PCB technology, instead of ceramic or silicon interposers, currently in use; although known to be time-intensive, high-cost options.

  • Organic Substrates

  • High Power Substrates

  • Radio Frequency Substrates

Advanced Packaging Assembly

Our unique assembly process designs enable you to achieve high-level customized results, with IC packaging solutions that are tailor-made to your specific applications. You are no longer bound to a particular design process dictated by individual fabricators or semiconductor packaging companies. Instead, we offer you the design freedom to choose among many custom options, such as Antenna in Package, Flip Chip QFN package technology, Filter on Package and more; to ensure solutions are perfectly aligned with your project needs.

  • Substrate BGA Solder Ball

  • Wire Bonding

  • Flip chip & Under-fill

  • Encapsulation, Molding, and Sealing

  • Die Bonder

  • Cu Pillars

  • Advanced Packaging

Technological Edge

When you think miniaturization, think iNPACK: experts in Organic Substrates and Enhanced Micro-electronics Packaging Technologies. iNPACK capabilities enable us to deliver complete and comprehensive substrate panel-level manufacturing and engineering support to our customers, in fact they depend on it. We continuously work to improve interconnections between PCB, Substrate and Semiconductors, through our know-how in advanced technologies. Solutions include Organic Substrate materials, IC Substrates, Die Packaging, Multi Chip Module technology (MCM), chip packaging and much more. With our creative solutions and enhanced design flexibility we can deliver high-speed, thermal and RF pathways that simplify integration processes, which in turn, improve overall system reliability. For your piece of mind, our common design rules (PCB, Substrate, and Packaging), are conveniently located under one roof.

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