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    Miniaturization - iNPACK


    Advanced Packaging & Organic Substrates – All-in-One Solutions

    Our offering of organic substrates of High-Density Line/Space width and advanced packaging allows for smaller form factor and increased functionality, high thermal conductivity, and process stability.

    SiP prototype or low/mid volumes production – highly compatible with aerospace, defense, medical, and other industries’ needs is our core business.
    Our specialization in heat dissipation solutions will assure your device’s high performance and reliability in the shortest time to market possible.


    Substrate Design

    Our substrate-like PCB or PCB-like substrate relies on subtractive processes as in the PCB industry, only with PPI resolution of 20 microns. The substrate is defined not only by its resolution but also by its heat dissipation and interconnection capabilities. We focus on resolving CTE mismatches between substrate and PCB or dies and substrate, the industry’s first and second-level reliability issues. We aim to enhance the system’s reliability by using organic substrates instead of ceramic or silicon interposers in current use. These are very exotic, expensive, and time-consuming processes.

    Advanced Packaging Assembly

    Our unique assembly process designs enable you a customized process, getting a package-on-package solution tailor-made to your applications. You are no longer bound to a certain design process created by a specific fabrication or packaging company. Instead, we offer you a design accustomed to your needs such as an antenna on package or a filter on package to name a few.

    Technological Edge

    1. iNPACK’s expert offering includes an organic substrate and enhanced micro-electronics packaging technologies. This enables us to deliver comprehensive substrate panel-level manufacturing and engineering support to our customers. We work to improve the interconnections between the PCB, substrate, and semiconductors through advanced technologies, creative solutions, and improved design flexibility, to deliver high-speed, thermal, and RF paths that simplify the integration process. This also has the benefit of improving system reliability. Our common design rules (PCB, substrate, and packaging) are all bundled under the same roof.

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