Advanced Packaging & Organic Substrates – All-in-One Solutions
Our offering of organic substrates of High-Density Line/Space width and advanced packaging allows for smaller form factor and increased functionality, high thermal conductivity, and process stability.
SiP prototype or low/mid volumes production – highly compatible with aerospace, defense, medical, and other industries’ needs is our core business.
Our specialization in heat dissipation solutions will assure your device’s high performance and reliability in the shortest time to market possible.