Talk to an Expert

LET'S TALK

IC Packaging

Think miniaturization, think iNPACK™

Advanced Packaging

Advanced Packaging is a blanket term used to describe a general grouping of various distinct methodologies. Advanced Packaging technologies include: 2.5D, 3D, Fan-Out (2D), Wafer Level Packaging and System-in-Package (SiP).

About System-in-Package (SiP) Technology

SiP is a combination of multiple active electronic components of diverse functionality, assembled in a single unit, that performs multiple functions associated with a system or sub-system.

SiP may optionally contain passives, MEMS, optical components and other packages or devices; including a combination of bare dies and SMT components.

SiP is designed to be a complete system within a single package, whereas a Multi-Chip-Module (MCM), containing two or more interconnected chips, isn’t necessarily a complete system.

Advanced Packaging Technologies

SiP / MCM Packaging

Heterogenous Integration

3D / 2.5D Packaging

2D Packaging = Integration method of mounting 2 or more dies horizontally on the surface of the substrate:

Takes up less space and provides more functionality compared with SMT

CTE matching, reinforced structure, good thermal dissipation solution

2.5D Packaging = 2 or more active semiconductor chips placed side-by-side on a silicon interposer for extremely high die-to-die interconnect density:

Takes up less space than 2D, when using high IO dies

Improved thermal and CTE matching

Reinforced structure

3D Packaging = Multiple layers/chips/wafers, stacked vertically and electrically interconnected, to enable die-on-die and package-on-package solutions:

Optimizes functionality

Superior system design featuring thermal, CTE and structural advantages

To get the file, fill in your Email

This website uses cookies to enhance the user experience.

Decline

Thank you

We will contact you shortly