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IC Packaging

Think miniaturization, think iNPACK™

Organic Substrate

iNPACK gives you all the options: A wide selection of expedient, high-quality, off-the-shelf substrate solutions, as well as fully customized solutions; featuring design support processes perfectly aligned with your unique specifications. Each alternative offers its own set of advantages and considerations, making it a pivotal choice for the optimum functionality and cost-effectiveness of your designs. Our experts are always available for consultation on which option can best serve your project vision. iNPACK substrates are based on industry-leading materials using a build-up process. In addition, we support flex rigid substrates, hybrid construction substrates and high thermal conductivity substrates.

Features

Features

1/1mil L/S

Cu pillars

Low CTE

High thermal conductivity

50-80 um via diameter

Fan-in /Fan-out through inserts

Interposer/connector substrates

Types

Types

Rigid or Flex substrates

Organic substrates

Laminate substrates

Build-up substrates

Applications

Applications

Medical

Automotive

Aerospace

Power

Communications: high-speed digital

Optical

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