iNPACK gives you all the options: A wide selection of expedient, high-quality, off-the-shelf substrate solutions, as well as fully customized solutions; featuring design support processes perfectly aligned with your unique specifications. Each alternative offers its own set of advantages and considerations, making it a pivotal choice for the optimum functionality and cost-effectiveness of your designs. Our experts are always available for consultation on which option can best serve your project vision. iNPACK substrates are based on industry-leading materials using a build-up process. In addition, we support flex rigid substrates, hybrid construction substrates and high thermal conductivity substrates.
High thermal conductivity
50-80 um via diameter
Fan-in /Fan-out through inserts
Rigid or Flex substrates
Communications: high-speed digital
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SLP – Substrate-Like PCB Technology
Eye-opening interview with PCB Technologies’ CTO Yaad Eliya about SLP Technology; exploring its huge growth potential and far-reaching impact on the design, fabrication and manufacturing processes of today’s hottest new products, applications, and near-future innovations.
Focusing on Substrate PCB