Thermal Management
Power dissipation and thermal management are major considerations in advanced chip design, posing several challenges that critically impact performance and functionality. Key issues include: Increased heat generation, performance degradation, limited thermal budget, reduced efficiency, plus packaging and design complexities. iNPACK are leaders in the continuous development of new techniques and innovative approaches that provide proven power dissipation solutions in advanced package design.
Critical design aspects to be considered
Major heat-dissipating components
Board size and thickness
Materials, layout, & component placement
Mounting peripherals
Application conditions & environment
Amount of heat to be dissipated
Cooling methods, (fans, heat sinks, etc.)
Our solutions
Cu coins (I-coin, T-coin, custom-coin)
Heat sinks (soldered, conductive adhesive, non conductive)
Thermal vias (Cu-filled, epoxy filled)
Cu thickness
Integrated active cooling designs
Specialized assembly solutions
iNPACK Relevant content
See All Articles
articles
X-VIA Technology: Critical for HDI Packages
articles
Why Introduce Graphene into Advanced PCBs?
articles
PCB Thermal Management Solutions
PCBs are the first heat management platform that electrical components meet. How you choose to handle the heat very much depends on the power dissipated from constituent components, line losses, board design, circuit editing, and mechanical structure. There are also thermal effects that arise from interconnect options on the board level, vias, transmission lines and assembly pad design.