High reliability, high-speed & high-density interconnect PCBs
We have grown accustomed to semiconductor supply chain delays ever since the COVID19 era began, and their effect on the lives of people all over the world is accelerating. The ever-growing demand for High-Density Interconnects, the main building block of electronic miniaturization technology, sets yet another challenge for PCB designers and manufacturers. These PCBs are expected to have extended functionality as well as decreased weight and energy consumption and deliver highly reliable, high-speed volume data transmissions meeting the market derivative of 5G technologies. All these are basic requirements in various applications they are designated for, such as automotive, aerospace, and medical, among others.
Semiconductor machine manufacturers, operating under tremendous stress to keep up with the ongoing global market demand for PCBs require not only high-speed operating machines but also highly accurate and reliable ones. PCB Technologies offers high reliability, high speed and high-density interconnect PCBs for the most advanced semiconductor manufacturers utilizing its vast and decade-long experience in raw materials, design, and fabrication.
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There are numerous types of sensors that require PCB design and fabrication - flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.
Antenna in Package
Chip packaging technology has become a key factor enabling smaller, lighter systems with increased functionality. When Radio Frequency integrated circuit (RFIC) chip is placed inside a package and connected to other components, this antenna-in-package (AiP) concept enables the reduction of the overall size and weight of the system and increases its cost efficiency. We at PCB Technologies can give our customers the benefit of a decade-long PCB and PCBA experience to be implemented in miniaturization solutions as well.
Wide range of Application in package adopted by chip developer for high-frequency applications from 60 GHz radios, to automotive radars, to phased arrays, to advanced sensors at 160 GHz up to 20 GHz for special applications.
Controller & Motion Systems/C4I Systems
Under controller systems applications, such as encoder position, piezo motors, servo compensation, step motor stall detection, brushless DC motor commutation, micro-step generation, digital current/torque control, and more, require a unique design and production of PCBs.
PCB designs for controllers and motion systems, such as C4I applications, require the ability to support sufficient current to the load, noise immunity for the load, and accurate current sensing.
In the case of motion controllers with integrated power electronics, network communications, and derive DC, step motors require specific PCB design rules.
Other PCB factors, such as compact size, range of power output levels, vibration, and high level of connectivity make PCB design and manufacturing challenging.
Processing light waves to enhance an image by the use of electrical periscopes, microscopes, telescopes, or cameras while converting electromagnetic waves into visible light is at the core of electro optics instrumentation. The more complex the instrument and its technology-based operation, the more its reliance on high reliability and high speed PCB, in which we specialize.
MEMS (Microelectromechanical systems) are the microscopic building blocks of modern electronics. MEMS device, which contains mechanical moving parts within the package, requires proper layout to ensure the highest performance in a finished product. PCB Technologies’ decade-long-experience in PCB design and fabrication contributes to our capacity to provide solutions for the market’s continued demand for miniaturization of electronic devices. We make sure every parameter related to their design does not go unnoticed such as the components sensitivity to mechanical and thermal stress coming from the PCB they’re assembled to, or the need to reduce PCB signal noise to ensure their smooth operation. We implement high-end technologies on accelerometers, gyroscopes, MEMS microphones, motion and pressure sensor modules, and more.
Fully automated factories relying on data automation efficiency and productivity are constantly increasing their utilization of technological advancements made in autonomous robots, big data, and internet of things (IoT), machine learning, simulation, and system integration. The main incentive of industry 4.0 manufacturers is to track down manufacturing errors as they occur. Big volumes of data analysis require highly reliable PCBs which should be tested and process controlled through each of their production stages. Industries 4.0 also requires PCB design which is able to combine RF, advances processors, antennas, miniaturization, optics and advanced technologies into one integrated system. PCB Technologies is the perfect fit in terms of know-how based on long years of PCB design and manufacturing, PCBA and full system integration.
High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.
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