All-in-One

We provide a wide range of Assembly Services for various products and industries based on cutting-edge automation and processes including POP – Package on Package, 01/005 Components, Micro BGAs, Flexible PCBs, Multi-Layered Prints, and more. Our services span from PCBA Assembly and mechanical assembly through integration and ICT,J-TAG, and final testing of PCBA, complete systems, and products. Also available – Acrylic coating by a fully automatic machine, Potting, Ultrasonic soldering, and DfM.
Whether you need a low volume or a high volume of PCBs, you’ll always receive the same high standards of quality from our certified manufacturing facility (ISO9001/ISO14001/ISO13485). All PCB Technologies solutions are assembled by certified experts (IPC-A-610 and J-STD-001.

Advanced System-in-Package (SiP) solutions are multi-component, multifunction products that leverage the strengths of PCB Technologies to offer higher levels of miniaturized integration with reduced lead times. These include:

1. Packaging Solutions
2.  Size reduction
3. High thermal conductivity
4. Ultra-thin with fine lines and spacing
5. Controlled CTE
6. 3D design
7.  Shielding options
8. Sealing solutions
9. Fine pitch flip-chip and copper pillar
10. Double side assembly
11. Development and production testing
12. Turnkey solutions

PCB Technologies’ unique value proposition allows us to create the most advanced and efficient all-in-one system solutions at a much shorter lead time. Our R&D center is located on the same premises as our manufacturing facility which means we can create a tailored SiP from design to manufacture, assembly, and testing.

We offer a suite of services to analyze the design of your PCB and ways that it can be improved for better quality, yields, delivery times, and cost savings.

Our Design for Manufacturing (DfM) services enable us to identify potential issues with a PCB during the design stage and recommend ways to improve cost, quality, and delivery times.

A DfM engineering analysis examines how we review the assembly of the PCB layer by layer and identify opportunities to reduce the number of layers or consolidate components – which saves you money.

We can also conduct post-build reviews after every production cycle, which allows us to recommend changes to the manufacturing process or PCB design to improve yields and reduce costs.

Our Design for Testability (DfT) services enable us to identify issues with your PCB design before you begin mass production. This will help to minimize defects in the PCB and maximize consistency in manufacturing.

An In-Circuit Test (ICT) can identify defects in the printed circuit board from the manufacturing process such as the wrong component or orientation, or missing components. PCB Technologies also delivers functional tests where the PCB is tested in the final production environment to ensure it functions as expected.

Our Value Analysis/Value Engineering (VA/VE) solution helps our customers to unlock the maximum value from their PCBs.

Combining Design for Manufacturing (DfM), Design for Testability (DfT), Design for Procurement (DfP), Design for Cost (DfC), and Design for Assembly (DfA) services, the VA/VE process focuses on unlocking greater product value through continuous improvements.
PCB Technologies works with customers on existing PCB designs to improve them over the product’s lifecycle for increased quality and lower operational costs. We also support our clients on new product designs from launch through to scaling up production and long-term management.

With our long history in cutting-edge design and production capabilities, many customers come to PCB Technologies for our full turnkey solutions.

We use the latest technologies and automation solutions to create quality production process tailored to your specific product needs.

This includes all aspects of assembly from integrating parts, cabling, and electronics into modules or the end product. We offer a full integration solution.
Our customers also benefit from our market purchasing power in sourcing the best components at a cost-effective price.