HDI boards, PCBA with BGA connectors, RF, and Rigid-Flex
High reliability, high-speed & high-density interconnect PCBs
High-reliability, high-quality PCBs - prototype to Low/Mid production volumes
HDI, Rigid/Rigid-Flex, RF boards, heat management solutions, and more
Supporting high reliability of your products and their long-term usage
Advanced PCB & miniaturization solutions compatible with high quality standards
SMT, substrate design & manufacturing, advanced materials and more
High-reliability, high-performance communication PCBs ensuring signal integrity
Superior heat dissipation, organic substrate and advanced packaging solutions
Our highly experienced engineering team is at your service – from design to fabrication for an All-in-One solution
Our sales team will be happy to provide you with a quote. Simply send us an email detailing your requirements and we’ll reply ASAP
We provide a wide range of PCB Assembly Services for various products and industries based on cutting-edge automation and processes including POP – Package on Package, 01/005 Components, Micro BGAs, Flexible PCBs, Multi-Layered Prints, and more. Our services span from PCBA Assembly and mechanical assembly through integration and ICT,J-TAG, and final testing of PCBA, complete systems, and products. Also available – Acrylic coating by a fully automatic machine, Potting, Ultrasonic soldering, and DfM.
Whether you need a low volume or a high volume of PCBs, you’ll always receive the same high standards of quality from our certified manufacturing facility (ISO9001/ISO14001/ISO13485). All PCB Technologies solutions are assembled by certified experts (IPC-A-610 and J-STD-001.
Advanced System-in-Package (SiP) solutions are multi-component, multifunction products that leverage PCB Technologies’ core strengths in order to offer our customers higher levels of miniaturized integration with reduced lead times. These include:
We offer a high-efficiency All-in-One Solution, resulting in brighter ideas and better-quality products at significantly shorter lead times. Our advanced R&D center, located within the same large complex as our manufacturing facilities, allows for the seamless creation of custom SiP; from design to manufacture, assembly, and testing.
An entire suite of Design for Manufacturing (DfM) services that expertly analyze PCB designs with the aim of improving quality, yields, and delivery times while also reducing costs.
Design for Testability (DfT) services help to identify possible snags with PCB designs before starting mass production, minimizing defects while maximizing reliability and repeatability.
The In-Circuit Test (ICT) can pinpoint defects in the board from the assembly process, such as component mismatches, misplacements, or missing components. PCB Technologies also delivers functionality tests, whereby PCBs are tested in their final production environment to ensure proper functionality according to specs.
Our Value Analysis/Value Engineering (VA/VE) solutions enable customers to gain the maximum value from their PCB designs. Unlocking greater product value through continuous improvements is facilitated by combining our services: Design for Manufacturing (DfM), Design for Testability (DfT), Design for Procurement (DfP), Design for Cost (DfC), and Design for Assembly (DfA).
PCB Technologies works hand-in-hand with customers not only to improve existing PCB designs but also to support clients’ new product designs, from launch through scaling-up production and long-term management.
With a long history of cutting-edge PCB design expertise, coupled with top-tier production capabilities, our customers rely exclusively on PCB Technologies for their PCB Full Turnkey projects.
We utilize the latest technologies and automation equipment to create high-quality production processes; tailored to the product requirements. Solutions involve all aspects of assembly — efficiently transforming part integration, cabling, and electronics, into modules or end products. Customers also benefit from our broad market purchasing power in sourcing the best components at cost-effective prices.
Learn about our advanced PCB design solutions offering high-performance Thermal Management options for Radio Frequency & Microwave applications.
PCBs are the first heat management platform that electrical components meet. How you choose to handle the heat very much depends on the power dissipated from constituent components, line losses, board design, circuit editing, and mechanical structure. There are also thermal effects that arise from interconnect options on the board level, vias, transmission lines and assembly pad design.
PCB Technologies’ iNPACK Division offers complete package PCB assembly solutions for both low and high-volume requirements. This includes SiP-system in package design and manufacturing, surface mount tech, chip on board (COB), microfabrication, and substrate design and manufacturing capabilities.
We will contact you shortly