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Miniaturization (iNPACK) - Organic Substrates & Advanced Packaging Solutions
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HDI boards, PCBA with BGA connectors, RF, and Rigid-Flex
HDI, Rigid/Rigid-Flex, RF boards, heat management solutions, and more
Supporting high reliability of your products and their long-term usage
High reliability, high-speed & high-density interconnect PCBs
Advanced PCB & miniaturization solutions compatible with high quality standards
High-reliability, high-quality PCBs - prototype to Low/Mid production volumes
SMT, substrate design & manufacturing, advanced materials and more
High-reliability, high-performance communication PCBs ensuring signal integrity
Superior heat dissipation, organic substrate and advanced packaging solutions
Our highly experienced engineering team is at your service – from design to fabrication for an All-in-One solution
Our sales team will be happy to provide you with a quote. Simply send us an email detailing your requirements and we’ll reply ASAP
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