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Consumer Electronics

SMT, substrate design & manufacturing, advanced materials and more

PCB Technologies decade-long expertise in PCB fabrication, PCBA, substrate design, and advanced packaging capabilities, benefit manufacturers of various consumer electronics devices, such as 5G technology reliant, gaming accessories, Internet-of-Things (IoT) based devices, home appliances, and others. We comply with the highest quality, safety, and durability standards to ensure your product can withstand the harshest operating conditions. Our All-in-One approach provides our customers with SMT, substrate design and manufacturing, advanced materials, process control design, process development, testing, and excellent supply chain services. All under the same roof. This guarantees a speedy transition from prototype to Low/Mid production volumes and a short time to market, which is most essential in today’s technology-driven end-users consumption behavior and the vibrating environmental conditions they present these devices with.


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Relevant Applications

  • Radars

    Radar PCB design requires, among other things, the use of high-frequency PCB materials, such as, teflon, ceramic, and hydrocarbon. This enables the measurement of the distance between objects blocked by electromagnetic wave travel time that the radars are programmed for. Airborne, grid, naval, or land radars, Phased array, as well as Yagi-Uda radar PCBs, all combine various digital and mixed-signal technologies using very high-frequency microwave signals which call for the special know-how and a common design rules kit we possess. PCB Technologies is a world leader in the design and manufacturing of radar PCBs including phased array air cavity antenna designs based on advanced semiconductor technology. This addresses the market’s demand for reduced size, weight, and power consumption of these elements. The next-generation design moves to a flat-panel approach, where each IC is easily mounted on the back of the antenna board allowing large-scale reduction of the antenna’s depth. The integration of higher frequency ICs (GaAs, GaN), makes advanced packaging and thermal management solutions key factor in the production of phased array air cavities to reduce the system’s physical size, improve its long-term reliability, and ensure more than one radiation pattern or data stream as common in conventional dish antennas. We also conduct complex tests and inspection procedures to ensure quality, highly reliable solutions for high reliability and mission-critical applications.

  • Sensors

    There are numerous types of sensors that require PCB design and fabrication - flow, image, level sensors, light, motion, position and temperature sensors to name a few. All of which rely on heavy-data transmissions and analysis gathered from the environment, manufacturing assets and equipment. Designing PCB for these types of sensors needs to take different parameters into account, such as the environment in which they operate, their form factor, power requirements, to ensure signal and power integrity at all times for their smooth functionality as well as cost, sensitivity, reliability, and rapidity of data. Our expertise in substrate design and fabrication allows for high precision miniaturized sensors applying minimum trace spacing, and width.

  • Antenna in Package

    Chip packaging technology has become a key factor enabling smaller, lighter systems with increased functionality. When Radio Frequency integrated circuit (RFIC) chip is placed inside a package and connected to other components, this antenna-in-package (AiP) concept enables the reduction of the overall size and weight of the system and increases its cost efficiency. We at PCB Technologies can give our customers the benefit of a decade-long PCB and PCBA experience to be implemented in miniaturization solutions as well. Wide range of Application in package adopted by chip developer for high-frequency applications from 60 GHz radios, to automotive radars, to phased arrays, to advanced sensors at 160 GHz up to 20 GHz for special applications.

  • Controller & Motion Systems/C4I Systems

    Under controller systems applications, such as encoder position, piezo motors, servo compensation, step motor stall detection, brushless DC motor commutation, micro-step generation, digital current/torque control, and more, require a unique design and production of PCBs. PCB designs for controllers and motion systems, such as C4I applications, require the ability to support sufficient current to the load, noise immunity for the load, and accurate current sensing. In the case of motion controllers with integrated power electronics, network communications, and derive DC, step motors require specific PCB design rules. Other PCB factors, such as compact size, range of power output levels, vibration, and high level of connectivity make PCB design and manufacturing challenging.

  • Optical Instruments

    Processing light waves to enhance an image by the use of electrical periscopes, microscopes, telescopes, or cameras while converting electromagnetic waves into visible light is at the core of electro optics instrumentation. The more complex the instrument and its technology-based operation, the more its reliance on high reliability and high speed PCB, in which we specialize.

  • GPS Systems

    Incorporating GPS (Global Positioning System) capabilities into PCB spanning from GNSS (Global navigation satellite system) antenna, ceramic patch, a GPS patch antenna, etc., makes navigation an easy task. These GPS PCBs can be adapted for various applications such as cars, drones, municipal, aviation, and logistics to name a few. Our decade-long-experience in the design and fabrication of different types of PCBs makes us the ideal partner for ensuring your GPS system’s components assembled to your PCB are properly isolated, high reliability of its signal integrity, and that the system as a whole can provide critical positioning information to military, civil, and commercial users.

  • MEMS Devices

    MEMS (Microelectromechanical systems) are the microscopic building blocks of modern electronics. MEMS device, which contains mechanical moving parts within the package, requires proper layout to ensure the highest performance in a finished product. PCB Technologies’ decade-long-experience in PCB design and fabrication contributes to our capacity to provide solutions for the market’s continued demand for miniaturization of electronic devices. We make sure every parameter related to their design does not go unnoticed such as the components sensitivity to mechanical and thermal stress coming from the PCB they’re assembled to, or the need to reduce PCB signal noise to ensure their smooth operation. We implement high-end technologies on accelerometers, gyroscopes, MEMS microphones, motion and pressure sensor modules, and more.

  • Power Devices

    High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.

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