PCB Thermal Management Solutions
Yaniv Meydar
|24th July ,2023
Introduction
PCBs are the first heat management platform that electrical components meet. How you choose to handle the heat very much depends on the power dissipated from constituent components, line losses, board design, circuit editing, and mechanical structure. There are also thermal effects that arise from interconnect options on the board level, vias, transmission lines and assembly pad design.
- Major heat-dissipating components
- Board size and thickness
- Materials, layout, & component placement
- Mounting peripherals
- Application conditions & environment
- Amount of heat dissipated
- Cooling methods, (fans, heat sinks, etc.)
By taking into consideration the factors listed above and more, PCB Technologies assist our customers to integrate best-practice thermal solutions into their board designs from the very start. Thermal management solutions we provide include:
- Cu coins (I-coin, T-coin, custom-coin)
- Heat sinks (soldered, deductive adhesive, non-conductive)
- Thermal vias (Cu-filled, epoxy filled)
- Cu thickness
- Integrated active cooling designs
- Specialized assembly solutions
Important to note: Designing with thermal management in mind means starting with a thermal simulation, carefully reviewing thermal solutions, and assessing how the manufacturing process will affect performance and price. Only then can you determine optimal board requirements.
