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Miniaturization technology – Controlling thermal expansion and power dissipation



20th January ,2022

Chip packaging technology becomes a key factor enabling smaller, lighter systems with increased functionality for various applications (automotive, aerospace, medical industrial, and others). To ensure system reliability and space reduction, the package should comply with several thermal, mechanical, and electrical requirements. PLS follow the link to a recently published article for further information.

Dense BGA

HDI fine pitch of 0.1

Heat sink

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