Innovation at its best – Packaging solutions at the COMCAS conference
8th November ,2021
Yaniv Maydar, PCB Technologies V.P. of R&D and Innovation, attended COMCAS, one of IEEE's prime conferences, held in Tel-Aviv.
The conference allows IEEE's community members to share innovative processes in the microwaves field. Yaniv introduced our vision for future packaging solutions to shift from PCB to substrate production and expand our interconnection capabilities.
Our All-in-One approach supplies assembly-substrate-PCB interfaces for both design and manufacturing, all under the same roof. You're welcome to get in touch, and we'll be happy to share our solutions for an innovative sub-panel-level packaging approach.