Modified Semi Additive Process (mSAP) boosts High-Density Interconnect (HDI) PCB capabilities
7th February ,2022
For decades, the microelectronic industry has been engaged in shrinking electronic devices sizes for various applications (automotive, aerospace, medical industries, and others). At the same time, the demand for extended functionality and reliability, not to mention the competitive costs of the final product, has posed an additional challenge to the miniaturization technology. The solution dictated high density of conductor lines in the underlying PCB, thus allowing High-Density Interconnect (HDI) PCB capabilities.
PCB Technologies utilizes the Modified Semi Additive Process (mSAP) for that end. The process is based on a detailed flow:
1. Coating the substrate surface with a very thin Copper layer
2. Laminating the Copper with photoresist suited for high-resolution PCBs
3. Using Laser Direct Imaging to draw the PCB design on the inner layer pattern
4. Fine etching and stripping of the undesired Copper plating (quick etching).
This process leaves the Copper layer unimpaired on the one hand, and decreases its width on the other, thus allowing HDI on organic substrates which can then be used for capsulated dies (Systems in Package). The added value of the process is its high yields on large-format boards, enabling control of manufacturing costs on substrate-like panels.