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MEET US @ IMS 2025
iNPACK
|3rd June ,2025
iNPACKTM (A PCB Technologies Company) will be showcasing our unique solutions for Custom IC Packaging, Substrates, Thermal Management and a variety of options such as Film Assisted Molding. We’re here to talk about RF/MW applications and any other issues of importance to you.
Don’t miss out, SCHEDULE A MEETING with our expert Tech-Team to discuss IC Packaging and all your project needs. We look forward to meeting you.
There’s always something new at iNPACKTM specializing in Miniaturization, Complex PCBs, Innovative IC Packaging Solutions .
