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Antenna-in-Package (AiP) Technology

PCB Technologies answers top-priority challenges for RF systems requirements by offering innovative System-in-Package (SiP) solutions, such as Antenna-in-Package (AiP) technology, to help Reduce Size, Weight, Power & Cost (SWaP-C), while also maintaining or even enhancing overall system performance.

AiP is an ideal solution that integrates one or more antennas directly into the same integrated circuit (IC) package as the RF transceiver chip, replacing traditional methods of placing antennas as separate components on or near the main PCB. This compact configuration, often utilizes flip-chip ball grid arrays and a package substrate; simplifying the design process; especially for millimeter-wave (mmWave) applications.

 

Key Advantages of AiP

  • Miniaturization & Space Savings: Placing the antenna and RF chip in a single package creates a much smaller form factor, which is essential for compact devices.
  • Enhanced Performance:
    • Reduced Signal Loss: A shorter interconnection between the antenna and the RF chip minimizes signal attenuation and improves signal integrity.
    • Better Thermal Performance: The integrated design more efficiently dissipates heat and extends system longevity than conventional configurations.
  • Improved Security & Resilience: Integrated package provides higher security levels against unauthorized access or tampering and is more resilient to harsh environmental factors like moisture or heat.
  • Simplified Manufacturing: Integrating the antenna and RF chip into one package reduces the number of components and assembly steps; streamlining the production process.
  • Design Flexibility: AiP technology and can be combined with other System-in-Package (SiP) technologies to house front-end components like power amplifiers, low-noise amplifiers, filters and switches within the same package, forming a complete antenna module.

 

Optimal Frequencies for AiP

Well-suited for high-frequency applications where antenna dimensions can fit within an IC package.

  • Wavelength and Antenna Size: The size of an antenna is directly related to the wavelength of the signal. At higher frequencies, the wavelength is shorter, allowing for smaller antennas.
    • 1 GHz: Wavelength (λ) is 30 cm.
    • 10 GHz: Wavelength is 3 cm.
    • 100 GHz: Wavelength is 3 mm.
  • Millimeter-Wave (mmWave) Spectrum: The mmWave spectrum (30-300 GHz), also known as the Extremely High Frequency (EHF) band, is the ideal fit for AiP. The small wavelengths (1-10 mm) allow for antennas that can be easily integrated into a package.
  • Other Frequencies: While mmWave is optimal, AiP is also used in the 1-30 GHz range.

 

Typical AiP Applications

The advantages of AiP have led to its rapid adoption across a wide range of industries and applications where size and weight constraints are critical, including:

  • 5G Mobile Networks: AiP is a perfect fit for 5G mmWave devices, as the smaller antennas required can be directly integrated into the package. It also supports the MIMO (Multiple In/ Multiple Out) antenna configurations needed for 5G diversity.
  • Automotive Radar: AiP is widely used in 77-GHz automotive radar systems.
  • Wireless Communication: It’s used in WiFi routers, wireless sensor networks, and high-frequency radios (e.g., 60-GHz gesture radar).
  • Medical & Defense: AiP is found in medical imaging and military & defense equipment, due to high performance attributes and security benefits.
  • Miniaturized / Compact Electronics: Drones, wearables. smartphones, medical devices, robotics, smart-home systems and more.

 

Potential Limitations

Although powerful, AiP technology isn’t suitable for all RF designs. Because RF components and antenna elements are modeled as a single unit, not individually, special efforts in up-front design, planning and implementation are necessary. Frequencies, thermal issues, RF power, DC power and other design aspects must be factored in, which may require special expertise for successful implementation.

 

What’s Next?

iNPACK offers a wide range of In-Package systems for high-frequency applications: From 60 GHz for radio, automotive radar, phased arrays, advanced sensors etc., and from 20 GHz up to 100 GHz for special applications. Have a question? Get in touch with one of our experts about your AiP design needs now.

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