PCB Applications

From medical diagnostics and industrial automation, to far-flung space exploration, the success of today’s sensor technologies ultimately hinges on the quality of the PCB Design and Fabrication processes invested in producing them. 

Sensor Ecosystems – includes flow, image, level sensors, light, motion, positioning and temperature sensors to name a few. Although extremely varied in functionality, they all rely heavily on-data transmissions and analysis gathered from the environment, manufacturing assets and specialized equipment. 

Designing PCBs for Sensors – requires meticulous, complex disciplines that factor-in numerous parameters: Environmental influences impacting operation, Form Factor, Power Requirements and Signal & Power Integrity, that can make or break reliability and repeatability for critical (no-fail) applications. 

Cost & Efficiency – Expertise in substrate design plus advanced FAB facilities (equipped with best-in-class Film Assisted Molding Machines), produce a wide range of Microelectronics, System-in-Package Solutions and high precision miniaturized sensors, with minimum trace spacing and width. Our common design rules (PCB, Substrate & Packaging) all under one roof, provide high-efficiency services that boost quality, reduce time to market and lower costs.

What Does Sensor Packaging Entail?

It’s is a complex form of integrated circuit (IC) packaging that integrates sensors with other components to perform specific functions; requiring electrical connections, structural protection and environmental interfaces. 

Key Innovation: MEMS technology enables miniaturized, high-sensitivity sensors, while advanced techniques such as System-in-Package (SiP) and 3D IC stacking allow for the heterogeneous integration of various components into a single, unified package. 

Safe-Keeping: Sensor packaging must offer protection from exposure and harsh operating conditions; extreme temperatures, vibrations and corrosive environments. This requires specialized materials and custom design processes to ensure continuous reliability and functionality.

Driving Force: We keep up with rapidly evolving sensor technology by devoting our strategic resources to R&D, as well as investing in advanced manufacturing processes, material sciences, miniaturization, and all-around sensor integration with newer technologies; namely AI, IoT and machine learning.

Types of PCB Sensors

• Temperature Sensors convert temperature changes into electrical resistance/voltage signals (Thermistors, RTDs, Thermocouples). Applications include: HVAC systems, CPUs, battery packs, industrial machinery.
• Pressure Sensors convert pressure into electrical signals to monitor gas or liquid pressure. Applications include: Automotive systems (e.g., tire pressure monitoring), medical devices, industrial automation.
• Motion & Acceleration Sensors measure linear acceleration or angular velocity and function as motion detectors, such as accelerometers and gyroscopes. Applications include: Smartphones, fitness trackers, wearables.
• Gas & Chemical Sensors detect various gases (e.g., carbon dioxide, carbon monoxide, methane, nitrogen dioxide). Applications include: Safety systems, environmental monitoring, smart homes, laboratories or industry.
• Humidity Sensors are embedded in PCBs when accurate environmental readings are necessary. Applications include: Weather stations, agricultural systems, air conditioning systems.
• Light Sensors also referred to as photodetectors, are designed to gauge ambient light intensity. Applications include: Smartphones, streetlights and solar applications for dimming or solar tracking.
• Touch and Proximity Sensors detect physical touch, or the proximity of an object, without actually touching it. Applications include: Robotics, touch screens and smart appliances.

About Us

PCB Technologies is uniquely positioned to offer our advanced design and fabrication capabilities for life-changing Microtechnology applications; specifically, BioMEMS & Sensors; essential in the production of so many new and exciting electronics being introduced into industrial processes and science-based disciplines worldwide.

Along with cutting-edge machinery, PCB Technologies also have the technical power. Our top-tier in-house engineering team is dedicated to supporting customers every step of the way; especially during the crucial early-stage design process.

As an All-in-One PCB Solutions Provider, we cover the entire product development process (all under one roof), making it simpler and easier for our customers to reach their project goals at a reduced time to market and with significant cost savings. 

Let’s talk Sensors, Contact Us.

Radar PCB design focuses on the need for dedicated materials coupled with specialized design expertise due to the very high-frequency microwave signals used in these systems. Basically, Radar systems operate by transmitting and receiving electromagnetic (EM) waves and calculating the travel time for these waves to bounce off objects, which in turn determines the distance to those objects. This functionality places stringent demands on the underlying PCB.

Airborne, grid, naval or land radar, phased-array, as well as Yagi-Uda radar PCBs, all combine various digital and mixed-signal technologies using very high-frequency microwave signals, which require exacting capabilities and a common design rules kit that PCB Technologies is able to provide. 

High-Frequency PCB Materials

The most critical requirement for radar PCBs is the use of high-frequency (RF/Microwave) dielectric materials. Standard FR-4 materials are generally unsuitable because they introduce significant signal loss and variations at the microwave frequencies (typically 1 GHz to over 100 GHz) that radar uses.

Key Material Types Include:

• Polytetrafluoroethylene (PTFE) or Teflon: Known for its extremely low dielectric loss tangent (tanδ), which minimizes signal power loss, and a stable dielectric constant (ϵr​) across a wide temperature range and frequency spectrum. This makes it a popular choice for high-performance radar.
• Ceramics: Often used in composite materials (ceramic-filled PTFE or hydrocarbon) or as purely ceramic substrates. They offer very stable (ϵr) and excellent thermal conductivity, which is crucial for managing heat from high-power components.
• Hydrocarbon Resins: These are often formulated into specialized laminates that provide a balance of high-frequency performance (low loss) and processing ease, sometimes acting as a lower-cost, high-performance alternative to pure PTFE.

Choosing the right material ensures the integrity of the microwave signal, enabling accurate measurement of EM wave travel time.

Design & Technology Integration

Radar PCBs are complex mixed-signal boards that integrate several distinct technology domains:

• RF/Microwave Front-End: This section handles the high-frequency transmit/receive path and includes components like power amplifiers (PAs), low-noise amplifiers (LNAs), mixers, and filters. This is where the specialized high-frequency materials are most critical, as signal traces must be designed as precise transmission lines (e.g., microstrip, stripline, coplanar waveguide).
• Analog/Mixed-Signal: This involves down-converting the high-frequency RF signal into an intermediate frequency (IF) or baseband signal, and then conditioning it using analog-to-digital converters (ADCs) and digital-to-analog converters (DACs).
• Digital/Processing Backend: This section, typically a high-speed digital board, houses the digital signal processors (DSPs) or Field-Programmable Gate Arrays (FPGAs) that perform the complex algorithms (like Fast Fourier Transform – FFT) to extract distance and velocity information from the digitized radar data.

Specialized Radar PCB Architectures

The principles apply across various radar implementations, requiring tailor-made design rules:

• Phased-Array Radars: These systems use an array of small antenna elements, where the phase of the signal to or from each element is individually controlled. This requires extremely tight phase and length matching on all transmission lines to ensure the antenna array can accurately steer and shape individual or multiple beams electronically.
• Yagi-Uda Radar PCBs: While less common for modern high-resolution systems, a Yagi-Uda antenna (a type of directional antenna) requires specialized transmission line design to connect to the PCB, often at lower frequencies or for simpler applications.
• Application-Specific Radars: The design must adapt to the operational environment, whether Airborne, Grid, Naval, or Land systems. For example, naval and land systems may have more robust environmental sealing requirements, while airborne systems prioritize weight and size constraints.
  

Key Design Expertise 

Successful radar PCB design requires a specific “know-how” and adherence to specialized design rules kit; particularly concerning Signal Integrity (SI) and Power Integrity (PI) at microwave frequencies:

• Impedance Control: Precise control of transmission line impedance (typically 50 Ω) is mandatory. Any deviation can cause reflections, leading to signal loss and inaccurate measurements.
• Crosstalk Mitigation: High-frequency signals can easily couple between adjacent traces. Shielding, proper spacing and ground plane stitching are essential.
• Via Design: Standard through-hole vias can introduce significant inductance and capacitance at microwave frequencies. Low-inductance via designs, such as blind/buried vias and back-drilling, are often necessary to maintain signal quality.
• Layer Stackup: The PCB layer stack-up must be precisely engineered to achieve the required controlled impedance and to provide robust isolation between RF, digital and power layers.
• Thermal Management: Radar systems, especially those using high-power amplifiers (HPAs), generate substantial heat. Effective thermal design, utilizing thermal vias, specialized materials, and heatsink integration, is critical for component reliability and performance stability.
  

Consult with the Experts

PCB Technologies is a world leader in the design and manufacture of radar PCBs, including phased array air cavity antenna designs based on advanced semiconductor technology. Our next-generation capabilities address market demands for reduced size, weight and power consumption. 

Utilization of a flat-panel approach, where each IC is easily mounted on the back of the antenna board, allows large-scale reduction of the antenna depth. The integration of higher frequency ICs (GaAs, GaN), makes advanced packaging and thermal management solutions a key factor in the production of phased array air cavities; reducing the physical size of the system. This improves long-term reliability, especially in multiple data stream radiation patterns. We also conduct complex testing protocols and inspection procedures to ensure full quality compliance. 

PCB Technologies provides all-in-one solutions for high-reliability and mission-critical applications. Contact us to find out more.

High power devices such as battery chargers, converters, heater controls, inverters, power supplies and switches discharge a large quantity of heat during their operations. Providing the customer with an extreme heat dissipation resistant PCB, while utilizing the PCB as a cooling system requires special expertise. PCB Technologies has the relevant know how in choosing the right materials for the job, as well as the stack up structure, plating, and advanced heating management solutions. We conduct route cause analysis on a regular basis to tackle problems such as repeated delamination between PCB layers caused by the extended heat. It takes a lot of experience in PCB design and fabrication to understand the different environmental conditions in which the PCB operates and its influence on the required heat dissipation solution. We believe getting our engineering team involved in the earliest stages of the PCB design, can serve as a game-changer in both time and money spent.

Electronic Warfare systems are aimed at identifying Friend or Foe (IFF) entities on the battlefield. Based on infrared, radio frequency, electromagnetic deception, and additional technologies, they are designed as countermeasures against enemy attacks. We offer high-end PCB design and manufacturing based on mixed materials, analog circuity design and various miniaturization technologies enabling these systems to withstand high-frequency, mechanical vibration, rapid acceleration, and extreme operating conditions. Our heat dissipation solutions guarantee mechanical and signal integrity at all times.

Designing and manufacturing PCBs for space modules, also referred to as Aerospace-Grade PCBs, involves strict adherence to rigorous standards applied in engineering and production processes, while using specialized techniques and unique materials to ensure failure-free operation in extreme environments.

These special-grade PCBs enable a wide array of devices and equipment critical to space missions and are engineered to withstand intense radiation, vacuum conditions, extreme thermal cycling and mechanical stress from launch vibrations. Space-related applications include:

SPACECRAFT, SATELLITES, PROBES & TELESCOPES:

• Communication Systems: Satellite transceivers, high-frequency radar and antenna control electronics.
• Data Handling: Onboard mission computers, data acquisition and processing units.
• Altitude & Control: Altitude control systems and navigational units.
• Power Systems: Solar panel power controllers, power conditioning units (PCUs) and battery management systems (BMS).

LAUNCH VEHICLES (ROCKETS) & SHUTTLES: 

• Guidance & Navigation: Flight control computers and inertial guidance systems.
• Propulsion: Rocket engine control electronics and thrust vector control modules.

SPACE EXPLORATION VEHICLES:

• Rovers & Landers: Control and processing units for mobility, instrumentation and scientific data collection.

PCB Design & Technical Requirements

PCB Technologies focuses on the technical aspects of design, materials and advanced manufacturing capabilities required to meet the challenges of flawless PCB functionality out in space; such as ultra-high frequency (UHF) at millimeter wavelengths, critical thermal management and extreme-reliability materials.

HIGH-FREQUENCY (RF/MICROWAVE) DESIGN: To handle communications at millimeter wavelengths (often 30−300 GHz), PCBs must maintain signal integrity across extremely high frequencies.

• Controlled Impedance: Trace geometry (width, thickness, spacing) and the dielectric constant (ϵr​) of the material must be tightly controlled to maintain a precise characteristic impedance (typically 50Ω or 75Ω). Imperfections can cause reflections and signal loss.
• Minimal Dielectric Loss (Low Df​): The Dissipation Factor (Df​) of the laminate material must be exceptionally low. High Df​ causes significant power loss and heat generation as frequency increases; severely impacting RF performance.
• Low Surface Roughness: Rough copper surfaces increase the Skin Effect loss at high frequencies. Manufacturing processes must ensure ultra-smooth copper foils (Reverse-Treated Foils) to minimize Insertion Loss.
• Vias & Interconnections: Vias must be designed to minimize parasitic inductance and capacitance, which can act as unintentional filters or resonators at millimeter-wave frequencies. Blind/Buried Vias and Micro-vias are often used to shorten signal paths.

THERMAL MANAGEMENT (HEAT DISSIPATION): Space modules generate significant heat, especially from high-power RF components, while also operating in a vacuum where convection cooling is impossible.

• Thermal Conductivity: The PCB material, or specialized layers within it, must have high thermal conductivity (k) to efficiently dissipate heat from active components to a heat sink or module chassis.
• Thermal Via Arrays: Dense arrays of copper-filled or plated thermal vias are placed directly under hot components (like power amplifiers). These act as high-efficiency thermal highways, conducting heat from a component solder pad on the top layer to internal ground planes or external heat sinks.
• Coefficient of Thermal Expansion (CTE) Management: In a thermal-cycling environment (extreme hot/cold), the PCB substrate and components expand and contract. Material’s CTE must be closely matched to that of key components (such as ceramic BGAs) to prevent solder joint fatigue and cracking. 

SPECIALIZED MATERIALS (COMPOSITES / EXOTIC MATERIALS): Standard FR-4 is inadequate for Aerospace-Grade requirements; where specialized laminates are essential.

Manufacturing Capabilities & Reliability

Material Handling & Production

• Hybrid Multilayers: Due to the mixed requirements (RF, Digital, Power), aerospace PCBs are often Hybrid Multilayers; combining different material types in a single stack-up (RF laminate layer for the critical communication path and a high-Tg​ epoxy for the digital control section). This requires complex, high-precision bonding and press cycles.
• Plasma Etching and Cleanliness: Manufacturing requires extremely fine line/space features for dense circuits and controlled impedance. Plasma etching is used for precise material removal, and the entire process must adhere to strict cleanliness standards (outgassing control for vacuum environments).

Robust Interconnects & Plating

• PTH Reliability: The drilling and plating of Plated Through-Holes (PTHs) must ensure complete and uniform copper coverage to prevent fracture during thermal cycling. Techniques like electroless copper deposition followed by electrolytic plating are critical.
• Surface Finish: The final metallic finish must be highly reliable, often using Electroless Nickel Immersion Gold (ENIG) or Immersion Silver (ImAg) for excellent solderability and long-term storage, while meeting outgassing requirements.

Space-Specific Qualifications

• NASA & ESA Standards: PCBs must comply with industry-specific quality and reliability standards, such as NASA or the European Space Agency (ESA), which mandate rigorous testing.
• Qualification Testing:
  • Thermal Shock/Cycling: Subjecting the PCB to rapid, extreme temperature changes (−55∘C to +125∘C) to test material and PTH integrity.
  • Vibration & Mechanical Shock: Simulates launch conditions, ensuring solder joints and features remain intact.
  • Outgassing Tests: Heating the board in a vacuum to ensure volatile materials (water, solvent residue) don’t escape, contaminating sensitive optical/mechanical systems on the spacecraft.

Consult with the Experts

PCB Technologies knows that the technical capabilities of space-worthy PCBs hinges on precision at every stage: from simulating high-frequency performance during design, selecting and bonding exotic materials, to ensuring every plated hole and copper trace will withstand both mechanical and thermal stresses of long-term space operations.

Along with our cutting-edge machinery, PCB Technologies also have the technical expertise. A top-tier in-house engineering team is dedicated to supporting customers every step of the way; especially during the crucial initial design process.

As an All-in-One PCB Solutions Provider, we cover the entire product development and production process (all under one roof), making it a simpler, faster and more quality-centric route to reaching your project goals — on-time and on-budget. 

Contact us to discuss high-reliability, mission-critical applications and more.

Our offering of organic substrates of High-Density Line/Space width and advanced packaging allows for smaller form factor and increased functionality, high thermal conductivity, and process stability.

SiP (System in Package) prototype or low/mid volumes production – highly compatible with consumer electronics, telecommunications, aerospace, defense, medical, and other industries’ needs is our core business.
Our specialization in miniaturization and heat dissipation solutions will assure your device high performance and reliability in the shortest time to market possible.

Phased array antennas with air cavities enable the precise timing of each antenna’s radiation pattern emission based on its position in the array. Our unique offering for the market’s demand for miniaturized, higher frequencies antennas is based on modeling, simulation, fabrication, and testing PCBs, turning them adaptable for IoT, vehicle radars, defense, aerospace, and more.

iNPACK’s expert offering includes advanced organic substrate and enhanced micro-electronics packaging technologies. This enables us to deliver comprehensive substrate panel-level manufacturing and engineering support to our customers, helping them to miniaturize their systems. We work to improve the interconnections between the PCB, substrate, and semiconductors through advanced technologies, creative solutions, and improved design flexibility. We aim to deliver high-speed, thermal, and RF paths that simplify the integration process. This also has the benefit of improving system reliability.

Biosensors detecting and analyzing biomarkers are a key component in the prevention, diagnosis, and determination of diseases, and their treatment. We offer high integration, advanced design, and high-volume production capabilities. In one example, our flexible PCBs were used as biosensors penetrating the patient’s body dramatically reducing the inspection time required during surgery. Our high-end miniaturization solutions enable these biosensors’ decreased form factor.

The microelectronic industry is intensively engaged in miniaturization for various applications (automotive, aerospace, medical industries, and others). The system size and reliability are dictated in many cases by the micro-assembly process, substrate, and interposer optimal design, and finally by the PCB configuration and its layout.

Our micro assembly technology enables smaller, lighter systems with increased functionality. To ensure system reliability and form factor reduction, our advanced packaging complies with thermal, mechanical, and electrical requirements.