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PHASED ARRAY ANTENNAS

Phased Array (PA) technology is crucial for modern high-performance electronic systems across multiple sectors because it allows for the electronic steering of a radio frequency (RF) beam without physically moving the antenna. This capability is vital for applications requiring rapid, precise and dynamic communication or sensing.

The core innovation behind this technology lies in the ability to precisely control the timing of the signal emitted from each element in an antenna array; enabling the radiation pattern to be focused and steered with high speed and accuracy. 

This critical shift in RF signal management; from mechanical beam steering to highly precise electronic control, has been essential in meeting market demand for miniaturized, higher-frequency antennas used in applications like IoT, Advanced Vehicle Radar, Military & Aerospace Systems and others. 

 

Key Features of Phased Array Applications: 

  • Miniaturization & Integration: Facilitates smaller, lighter, and more conformable antenna systems, essential for IoT and modern Aerospace platforms.
  • High-Frequency Performance: Enables highly efficient operation at higher frequencies (millimeter wave), supporting high-bandwidth communication and high-resolution radar.
  • Enhanced Reliability & Speed: Eliminates moving parts (motors, gimbals), improving reliability and scanning speed, crucial for Vehicle Radar Systems like ADAS/autonomous driving.
  • Defense & Security: Supports Military & Defense operations (Active Electronically Scanned Array (AESA) radar) for simultaneous search & track, quick reaction time and low probability of intercept (LPI) communications.

 

Relying on PCB Expertise: The realization of sophisticated Phased Array Antenna devices is heavily dependent on advanced PCB design, engineering and manufacturing capabilities aimed at unique solutions for the complex integration, high-frequency performance and demanding physical constraints of PA systems.

  • High-Frequency Laminates (Substrate Materials):
    • Requirement for low-loss dielectric materials (PTFE-based or hydrocarbon ceramics) to minimize signal attenuation at high frequencies.
    • Materials possessing stable dielectric constants and dissipation factors over temperature and frequency.
  • Air Cavities & Structures:
    • Phased Array Antennas with “air cavities” implies the use of specialized structures within or near the PCB (in the package or substrate), to precisely control effective dielectric constant and radiation pattern/impedance matching; ensuring precise timing of emission.
  • Manufacturing Capabilities:
    • Tight Tolerance Etching/Stack-up, for the precise geometry of transmission lines (microstrip, strip-line) and antenna elements, to maintain signal integrity and phase accuracy.
    • Advanced Plating and Via Technologies, for robust interconnections and efficient heat dissipation in high-power systems.
  • Design, Simulation, & Testing
    • Sophisticated Electromagnetic (EM) Modeling & Simulation tools are required to predict array performance and account for coupling between elements.
    • Use of special testing protocols (anechoic chamber testing, near-field scanning) are mandatory for full array characterization and calibration.

 

Specialized PCB Technology 

PCB Technologies is a world leader in the manufacture of Phased Array Air-Cavity Antenna Designs based on advanced semiconductor technology. Our next-generation capabilities address market demands for reduced size, weight and power consumption. 

iNPACK (a PCB Technologies Division) offers a wide range of In-Package Systems for high-frequency applications: From 60 GHz for radio, automotive radar, phased arrays, advanced sensors etc., and from 20 GHz up to 100 GHz for special applications. 

Integration of higher frequency ICs (GaAs, GaN), makes advanced packaging and thermal management solutions a key factor in the production of Phased Array air cavities; reducing the physical size of the system. This improves long-term reliability, especially in multiple data stream radiation patterns. We also conduct complex testing protocols and inspection procedures to ensure full quality compliance.

Exacting PCB Solutions: 

  • High-Frequency Materials: Standard PCB materials (like FR-4) are too lossy at high operating frequencies (often 24GHz) for radar or 5G communications. Specialized high-frequency laminates with a very low dissipation factor (tan(δ)) are required to minimize signal loss, while ensuring efficient supply of power reaches the antenna elements.
  • Precise Layer Stacks & Air Cavities: The structure of the PCB (stack-up) is precisely engineered. The inclusion of air cavities; either actual voids or low-dielectric constant regions, near the antenna elements, is a design technique used to:
    1. Lower the effective dielectric constant surrounding the radiating element, to improve radiation efficiency.
    2. Ensure precise impedance matching for a better power transfer.
    3. Control the precise propagation speed of the RF signal to the element; fundamental to achieving the precise timing required for beam steering.
  • Integration & Miniaturization: The PCB acts as a substrate not only for the transmission lines and antenna elements but also for highly integrated active components, such as the Transmit/Receive Modules and Phase Shifters. Advanced PCB manufacturing allows for the tight dimensional control and fine features that can closely pack these components; achieving the necessary miniaturization.

 

Taking It to The Next Level

PCB Technologies is with you every step of the way, from initial PCB design, through fabrication, to full system integration. Customers rely on our cutting-edge know-how, advanced PCB manufacturing processes and dedicated iNPACK Division for expert miniaturization and IC packaging capabilities.

We’re also an All-in-One Solutions provider, ensuring a speedy transition from prototype to low/mid production volumes for high-reliability applications all under one roof. We keep a watchful eye on quality, cost and timelines, while you avoid the uncertainties of jobbing out to external vendors.

Contact us about your Phased Array Antenna requirements, or any other special project.

 

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