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Start Innovating Med-Tech with iNPACK
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28th July ,2026
Stop by BOOTH 627, meet our expert tech team and explore cutting-edge IC packaging solutions built for next-generation medical devices.
ALL-IN-ONE SOLUTIONS. ALL UNDER ONE ROOF:
- Advanced IC Packaging:
Flip-Chip, 2.5D, 3D & more - Custom Engineering:
Substrates & tailored package designs - Full-Spectrum Assembly:
Semiconductor & electronics assembly + testing - Optimized Manufacturing:
High-efficiency, time- & cost-saving fabrication - Maximum Reliability:
Built for high-performance medical applications
We look forward to seeing you there!
iNPACK Technical Sales Team